polishing wafer
polishing wafer
shared：
polished wafer Specifications
| Thickness（µm） | TTV（µm） | TIR（µm） | BOW（µm） | WARP（µm） | LLS(ea） | ||
| FZ-Si-polished wafer | Single side polished wafer | 150-1500 | ≤5 | ≤5 | ≤20 | ≤20 | <10@0.3μm |
| Double sides polished wafer | 150-1500 | ≤5 | ≤5 | ≤20 | ≤20 | <10@0.3μm | |
| CZ-Si-polished wafer | Single side polished wafer | 150-1500 | ≤5 | ≤5 | ≤20 | ≤20 | <10@0.3μm |
| Double sides polished wafer | 150-1500 | ≤5 | ≤5 | ≤20 | ≤20 | <10@0.3μm | |
Note：If customer has any special requirements on geometrical parameters, we can process accordingly.
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CZ-Si
